What is the Dimer,Parylene F?

Dimer,Parylene F is , while it's Molecular Formula is C16H8 F8. Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation

What is the CAS number for Dimer,Parylene F?

The CAS number of Dimer,Parylene F is 1785-64-4.

What is Dimer,Parylene F (1785-64-4) used for?

Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.

What is the Dimer,Parylene F?

Dimer,Parylene F is , while it's Molecular Formula is C16H8 F8. Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation

What is the CAS number for Dimer,Parylene F?

The CAS number of Dimer,Parylene F is 1785-64-4.

What is Dimer,Parylene F (1785-64-4) used for?

Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.

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1785-64-4

Product Name:Parylene F(VT-4)
Molecular Formula:C16H8 F8
Molecular Weight:352.227

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Product Details

pd_meltingpoint:>205 °C (sublm)

Purity:99%

Factory Supply industrial standard Parylene F(VT-4) 1785-64-4 In Stock

Molecular Formula:C16H8 F8
Molecular Weight:352.227
Melting Point:>205 °C (sublm)
Boiling Point:321 ºC
Flash Point:117 ºC
PSA：0.00000
Density:1.497
LogP:4.68320

1785-64-4 Relevant articles

Preparation method of parylene

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Paragraph 0067-0069; 0072-0073, (2021/04/03)

The invention discloses a preparation me...

Octafluorofluoro-cyclic di-p-xylyene and synthesis method thereof

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Paragraph 0049-0073, (2019/02/04)

The invention discloses a method for syn...

Method for using microchannel reactor to prepare paracyclophane monomeric compound

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Paragraph 0070; 0074-0077, (2017/08/23)

The invention discloses a method for usi...

1785-64-4 Process route

: 92-84-2
10H-phenothiazine

: Trimethyl-(2,3,5,6-tetrafluoro-4-methyl-benzyl)-ammonium; hydroxide

: 1785-64-4
4,5,7,8,12,13,15,16-octafluoro(2.2)paracyclophane

Conditions

Conditions	Yield
In toluene; for 8h; Heating;	42%

: 106112-29-2
5,6,8,9,14,15,17,18-octafluoro-2,11-dithia(3.3)-paracyclophane

: 1785-64-4
4,5,7,8,12,13,15,16-octafluoro(2.2)paracyclophane

Conditions

Conditions	Yield
With triethyl phosphite; for 11h; Irradiation;	26%

1785-64-4 Upstream products

92-84-2
10H-phenothiazine
106112-29-2
5,6,8,9,14,15,17,18-octafluoro-2,11-dithia(3.3)-paracyclophane
703-87-7
1,4-dimethyl-2,3,5,6-tetrafluorobenzene
776-40-9
α,α’-dibromo-m-tetrafluoroxylene

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